Ordering information
Type number  

 

 

Package

 

 

Name

 

 

Description

 

 

Version

 

MF3ICD8101DUD/05 FFC 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECSII format); see Ref. 4, 8K EEPROM, 17pF input capacitance -
MF3ICD4101DUD/05 FFC 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECSII format); see Ref. 4, 4K EEPROM, 17pF input capacitance -
MF3ICD2101DUD/05 FFC 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECSII format); see Ref. 4, 2K EEPROM, 17pF input capacitance -
MF3ICDH8101DUD/05 FFC 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECSII format); see Ref. 5, 8K EEPROM, 70pF input capacitance -
MF3ICDH4101DUD/05 FFC 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECSII format); see Ref. 5, 4K EEPROM, 70pF input capacitance -
MF3ICDH2101DUD/05 FFC 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECSII format); see Ref. 5, 2K EEPROM, 70pF input capacitance -
MF3MOD8101DA4/05 PLLMC[1] plastic leadless module carrier package; 35 mm wide tape; see Ref. 6, 8K EEPROM, 17pF input capacitance SOT500-2
MF3MOD4101DA4/05 PLLMC[1] plastic leadless module carrier package; 35 mm wide tape; see Ref. 6, 4K EEPROM, 17pF input capacitance SOT500-2
MF3MOD2101DA4/05 PLLMC[1] plastic leadless module carrier package; 35 mm wide tape; see Ref. 6, 2K EEPROM, 17pF input capacitance SOT500-2

 

MF3MODH8101DA4/05 PLLMC[1] plastic leadless module carrier package; 35 mm wide tape; see Ref. 6, SOT500-2
    8K EEPROM, 70pF input capacitance  
MF3MODH4101DA4/05 PLLMC[1] plastic leadless module carrier package; 35 mm wide tape; see Ref. 6, SOT500-2
    4K EEPROM, 70pF input capacitance  
MF3MODH2101DA4/05 PLLMC[1] plastic leadless module carrier package; 35 mm wide tape; see Ref. 6, SOT500-2
    2K EEPROM, 70pF input capacitance   

Mifare DESFire EV1 4K Card,NXP MF3ICD41 Cards,RFID Mifare DESFire EV1 4K Printing Cards,HF 13.56MHz DESFire 4K Proximity Cards,

Fig 1. Block diagram of MF3ICD(H)81, MF3ICD(H)41, MF3ICD(H)21

ISO/IEC 14443-3
Command Description
REQA REQA and ATQA are implemented fully according to ISO/IEC 14443-3
UPA WUPA is implemented fully according to ISO/IEC 14443-3
ANTICOLLISION/SELECT Cascade Level 1 ANTICOLLISION and SELECT commands are implemented fully according to ISO/IEC 14443-3; the response is part 1 of the UID
ANTICOLLISION/SELECT Cascade Level 2 ANTICOLLISION and SELECT commands are implemented fully according to ISO/IEC 14443-3; the response is part 2 of the UID
HALT brings MIFARE DESFire EV1 to the HALT state

 

 

ISO/IEC 14443-4

 

Command Description
RATS identifies the MIFARE DESFire EV1 type to the PCD
PPS allows individual selection of the communication baud rate between PCD and MIFARE DESFire EV1; for DESFire it is possible to set different communication baud rates for each direction i.e. DESFire allows a non-symmetrical information interchange speed.
WTX if the MIFARE DESFire EV1 needs more time than the defined FWT to respond to a PCD command it requests a Waiting Time eXtension (WTX)
DESELECT allows MIFARE DESFire EV1 to be brought to the HALT state