Mifare Plus Ordering information (Part 1):

Type number Package
Commercial name Name Description Version
MF1PLUS8001DUD/03 FFC  - 8 inch wafer (sawn; 120 μm thickness, on film frame carrier; electronic fail die marking according to SECS-II format),     4 kB EEPROM,7-byte UID, L1 card  -
       
       
       
       
MF1PLUS8001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 7-byte UID, L1 card SOT500-2
       
       
       
MF1PLUS8011DUD/03 FFC  - 8 inch wafer (sawn; 120 μm thickness, on film frame carrier; electronic fail die marking according to SECS-II format),           4 kB EEPROM, 4-byte UID, L1 card  -
       
       
       
       
MF1PLUS8021DUD/03 FFC  - 8 inch wafer (sawn; 120 μm thickness, on film frame carrier; electronic fail die marking according to SECS-II format),
4 kB EEPROM, 4-byte UID, UID0 = XFh according to ISO/IEC 14443-3, L1 card
 -
       
       
       
       
       
MF1PLUS8011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 4-byte UID, L1 card SOT500-2
       
       
       
MF1PLUS8021DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 4-byte UID,
UID0 = XFh according to ISO/IEC 14443-3, L1 card
SOT500-2
       
       
       
       
MF1PLUS6001DUD/03 FFC  - 8 inch wafer (sawn; 120 μm thickness, on film frame carrier; electronic fail die marking according to SECS-II format),
2 kB EEPROM, 7-byte UID, L1 card
 -
       
       
       
       
MF1PLUS6001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 7-byte UID, L1 card SOT500-2
       
       
       

 

Mifare Plus Ordering information (Part 2):

Type number Package
Commercial name Name Description Version
MF1PLUS6011DUD/03 FFC  - 8 inch wafer (sawn; 120 μm thickness, on film frame carrier; electronic fail die marking according to SECS-II format),
2 kB EEPROM, 4-byte UID, L1 card
 -
       
       
       
       
MF1PLUS6021DUD/03 FFC  - 8 inch wafer (sawn; 120 μm thickness, on film frame carrier; electronic fail die marking according to SECS-II format),
2 kB EEPROM, 4-byte UID, UID0 = XFh
according to ISO/IEC 14443-3, L1 card
 -
       
       
       
       
       
MF1PLUS6011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 4-byte UID, L1 card SOT500-2
       
       
       
MF1PLUS6021DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 4-byte UID,
UID0 = XFh according to ISO/IEC 14443-3, L1 card
SOT500-2
       
       
       
       
MF1PLUS8001DUD/13 FFC  - 8 inch wafer (sawn; 120 μm thickness, on film frame carrier; electronic fail die marking according to SECS-II format),
4 kB EEPROM, 7-byte UID, no security level 1 or 2, L3 card
 -
       
       
       
       
       
MF1PLUS8001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 7-byte UID, no security level 1 or 2, L3 card SOT500-2
       
       
       
MF1PLUS6001DUD/13 FFC  - 8 inch wafer (sawn; 120 μm thickness, on film frame carrier; electronic fail die marking according to SECS-II format),
2 kB EEPROM, 7-byte UID, no security level 1 or 2, L3 card
 -
       
       
       
       
       
MF1PLUS6001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 2 kB EEPROM, 7-byte UID, no security level 1or 2, L3 card SOT500-2